Squashed backup commit (no shallow-clone history issues) of xiaomi-mt6833-dev/kernel_xiaomi_mt6833 (lineage-23.2 branch, upstream commit 9eece662e) plus all fixes applied to get everpal_defconfig building clean against a modern (GCC 15.2.0) toolchain -- see the previous commit message on the lineage-23.2 branch (also in this repo history is not available here since this is a squashed snapshot; full incremental history lives in the local DL380 checkout and the upstream GitHub remote). Upstream: https://github.com/xiaomi-mt6833-dev/kernel_xiaomi_mt6833 (lineage-23.2)
18 lines
342 B
C
18 lines
342 B
C
/*
|
|
* This header provides constants for most thermal bindings.
|
|
*
|
|
* Copyright (C) 2013 Texas Instruments
|
|
* Eduardo Valentin <eduardo.valentin@ti.com>
|
|
*
|
|
* GPLv2 only
|
|
*/
|
|
|
|
#ifndef _DT_BINDINGS_THERMAL_THERMAL_H
|
|
#define _DT_BINDINGS_THERMAL_THERMAL_H
|
|
|
|
/* On cooling devices upper and lower limits */
|
|
#define THERMAL_NO_LIMIT (~0)
|
|
|
|
#endif
|
|
|