Files
android/include/dt-bindings/thermal/thermal.h
T
threeeye bc1d038eac REVVL 6 Pro kernel bring-up: full working tree snapshot (2026-09-12)
Squashed backup commit (no shallow-clone history issues) of
xiaomi-mt6833-dev/kernel_xiaomi_mt6833 (lineage-23.2 branch, upstream
commit 9eece662e) plus all fixes applied to get everpal_defconfig building
clean against a modern (GCC 15.2.0) toolchain -- see the previous commit
message on the lineage-23.2 branch (also in this repo history is not
available here since this is a squashed snapshot; full incremental history
lives in the local DL380 checkout and the upstream GitHub remote).

Upstream: https://github.com/xiaomi-mt6833-dev/kernel_xiaomi_mt6833 (lineage-23.2)
2026-09-12 13:36:46 +00:00

18 lines
342 B
C

/*
* This header provides constants for most thermal bindings.
*
* Copyright (C) 2013 Texas Instruments
* Eduardo Valentin <eduardo.valentin@ti.com>
*
* GPLv2 only
*/
#ifndef _DT_BINDINGS_THERMAL_THERMAL_H
#define _DT_BINDINGS_THERMAL_THERMAL_H
/* On cooling devices upper and lower limits */
#define THERMAL_NO_LIMIT (~0)
#endif