threeeye
bc1d038eac
Squashed backup commit (no shallow-clone history issues) of xiaomi-mt6833-dev/kernel_xiaomi_mt6833 (lineage-23.2 branch, upstream commit 9eece662e) plus all fixes applied to get everpal_defconfig building clean against a modern (GCC 15.2.0) toolchain -- see the previous commit message on the lineage-23.2 branch (also in this repo history is not available here since this is a squashed snapshot; full incremental history lives in the local DL380 checkout and the upstream GitHub remote). Upstream: https://github.com/xiaomi-mt6833-dev/kernel_xiaomi_mt6833 (lineage-23.2)
39 lines
1.1 KiB
C
39 lines
1.1 KiB
C
/*
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* db8500_thermal.h - DB8500 Thermal Management Implementation
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*
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* Copyright (C) 2012 ST-Ericsson
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* Copyright (C) 2012 Linaro Ltd.
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*
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* Author: Hongbo Zhang <hongbo.zhang@linaro.com>
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*
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* This program is free software; you can redistribute it and/or modify
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* it under the terms of the GNU General Public License as published by
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* the Free Software Foundation; either version 2 of the License, or
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* (at your option) any later version.
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*
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* This program is distributed in the hope that it will be useful,
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* but WITHOUT ANY WARRANTY; without even the implied warranty of
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* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
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* GNU General Public License for more details.
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*/
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#ifndef _DB8500_THERMAL_H_
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#define _DB8500_THERMAL_H_
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#include <linux/thermal.h>
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#define COOLING_DEV_MAX 8
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struct db8500_trip_point {
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unsigned long temp;
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enum thermal_trip_type type;
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char cdev_name[COOLING_DEV_MAX][THERMAL_NAME_LENGTH];
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};
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struct db8500_thsens_platform_data {
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struct db8500_trip_point trip_points[THERMAL_MAX_TRIPS];
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int num_trips;
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};
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#endif /* _DB8500_THERMAL_H_ */
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